The First International Workshop on Intelligent Bug Fixing (IBF 2019)


The workshop will focus on intelligent bug fixing. Generally, bug fixing process includes bug understanding (i.e., bug reproduction, severity/priority verification, bug summarization, bug classification, bug knowledge extraction), bug localization, bug fixing, and bug validation. By using data mining, information retrieval, machine learning, natural language processing, artificial intelligence technologies, visualization technologies, human-computer Interaction technologies and code analysis technologies, a series of new automated algorithms will be proposed to improve the performance of developers bug fixing process. In this workshop, we solicit high-quality contributions with consolidated and thoroughly evaluated application-oriented research results in the area of intelligent bug fixing. It is intended to (i) provide a summary of research that advances intelligent bug fixing using multiple data analysis and processing techniques, and (ii) serve as a comprehensive collection of some of the current state-of-the-art technologies within this content.


  • Big Data in Bug Fixing Activities
  • Bug Analysis
  • Software Artifacts Generation
  • Bug Summarization/Enrichment
  • Duplicates Detection
  • Bug Severity/Priority Prediction
  • Bug Assignment • Bug Localization
  • Automated Program Repair
  • Empirical Studies in Bug Analysis and Fixing
  • Intelligent Software Repair
  • Intelligent Software Testing
  • Knowledge Graph for Bug Fixing
  • AI in Intelligent Bug Fixing

Important Dates:

  • Abstract submission: December 14, 2018
  • Paper submission: December 21, 2018
  • Notifications: January 11, 2019
  • Camera ready deadline: January 22, 2019
  • Workshop day: February 24, 2019


Our workshop is co-located with SANER 2019 ( Authors are invited to submit their manuscripts written in English by the deadline via the conference online submission system. We accept full research and industrial papers (not exceed 10 pages) and new idea and viewpoint papers (not exceed 6 pages). The submissions must comply with the format of IEEE Proceedings. We invite the authors of selected papers to submit their extended versions to a special issue of IEEE Transactions on Reliability or IEEE Access.

Organizing Committee:

Shing-Chi Cheung (, The Hong Kong University of Science and Technology
Xiaobing Sun (, Yangzhou University
Tao Zhang (, Harbin Engineering University